Energy-Efficient Integrated Circuits and Systems Lab (EEIS)
高能效集成电路与系统实验室
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来源: | 作者:cmh | 发布时间: 2025-07-03 | 64 次浏览 | 分享到:

This paper introduces a backscatter IC demonstrating pragmatic BLE connectivity  for wearable sensors as illustrated in Fig. 1 by: 1) integrating a dual-linearly  polarized microstrip patch antenna (DPMPA) that allows concurrent RF energy  harvesting and bidirectional communication in a wearable form factor; 2)  demodulating the downlink BLE packets with improved robustness through a  proposed self-calibrated GFSK demodulator; 3) transforming a reversely-whitened  BLE packet into an SSB GFSK modulated BLE packet via proposed replica VCObased GFSK modulator and inductor-free load-multiplexing reflector.

本文介绍了一款后向散射集成电路(IC),通过以下创新实现了适用于可穿戴传感器的实用型蓝牙低功耗(BLE)连接:

1) 集成了一种双线性极化的微带贴片天线(DPMPA),可在可穿戴设备尺寸限制下同时实现射频(RF)能量收集与双向通信;

2) 通过所提出的自校准GFSK解调器,增强了对下行链路BLE数据包解调的鲁棒性;

3) 利用所设计的基于副本VCO的GFSK调制器及无电感负载复用反射器,将反向去白化的BLE数据包转换为单边带(SSB)GFSK调制的BLE数据包。